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Pentium III CPU

Pentium III-based 400Mhz system processor with 256MB soldered DRAM.

Form Factor: 3U
Part Number: OSS-CPCI-3U-CPU-P3-400-256

Product Features

  • 400Mhz Mobile Pentium III system processor
  • 256MB soldered DRAM with optional 128MB DRAM
  • USB, Firewire, Fast Ethernet, VGA
  • Configured for rear I/O
  • Lynx3DM graphic accelerator, 8MBVRAM
Specifications

Processor Mobile Pentium III 400Mhz, BGA2 package with interposer (100Mz PSB, 128kByte L2 cache)
Memory
  • 256MByte soldered synchronous DRAM with optional BIOS activated ECC feature.
  • Additional Piggyback provides additional 128MB
FLASH-Disk Available as an option (Disk-on-Chip™)providing up to 500MByte FLASH
Battery Lithium cell for RTC (NV-RAM) with a lifetime > 8 years
North Bridge 440BX North Bridge 82443BX supporting 100MHz system bus DRAM controller with 64bit, 100MHz SDRAM interface, ECC support, AGP 2X interface (66/133MHz), Power management
South Bridge M1543C: PCI/ISA Bridge, Super I/O: 1 Floppy Disk Controller, 1 Parallel Port, 2 Serial Ports, Fast IR, IDE Controller (4 devices), Ultra 66 DMA support, 12Mbit/s USB controller, Interrupt controller, Power Management Unit, Full support for ACPI and OS directed power management, Mouse & keyboard controller
Graphics Lynx3DM or Radeon VE graphic accelerator: 8/16Mbyte RAM, 3D graphics, DVD & MPEG-2 support Multi-Display, Dual View support under Microsoft, Windows 9x, Windows NT & 2000, CRT / TFT resolutions up to 2048x1536, GigaST R / PanelLink, TFT Piggyback Dual display option or TFT will require dedicated front-panel.
Recovery BIOS FLASH Recovery BIOS
Watchdog Programmable up to 10 minutes; issues NMI
PCI/PCI Intel 21150 transparent bridge (Master) or Intel 21554 non-ttransparent PCI/PCI bridge for multiprocessing (Slave) operation with Basic Hot-Swap support (PICMG 2.1 R1.0), Serialized interrupts and universal (3.3/5.0V) V I/O support
On-Board I/O 10/100 Mbit/s Ethernet (Intel 82559), optional 2nd independent Fast Ethernet, Up to 2x 12Mbit/s USB, Up to 2x 400Mbit/s FireWire interfaces
Rear I/O Standard to all CPU variants is option ‘C’ which provides 2nd FireWire channel, 2nd USB channel, LPT1 (Floppy), EIDE and loudspeaker. Other I/O configurations including customized are possible.
Mass Storage 1.44MByte 3.5” floppy drive and EIDE (flex cable/rear I/O) supporting 2 pairs (Master/Slave) hard-disks or CD ROMs
Front-Panels
  • Optional 4TE front-panel extension provides: COM1, COM2, keyboard, PS-2 mouse
  • Extended front-panel (4TE) provides: COM2, LPT1
Connectors USB (USB), RJ45 (Ethernet), 6-pin FireWire (FireWire), 15-pin D-Sub (PanelLink), 15-pin high-density D-Sub (VGA), 9-pin D-Sub (GigaST R)
CompactPCI PICMG 2.0 R3.0, 32-bit, 33MHz system slot interface with 7 Master (DMA) support. Dual-slot operation
Mechanics
  • 3U (100 x 160 x 21mm) 4 TE
  • 3U (100 x 160 x 42mm) 8 TE
  • 3U (100 x 160 x 63mm) 12 TE

 

Power Consumption
  • 25W typ. PIII @ 850MHz (Lynx)
  • 21W typ. PIII @ 700MHz (Lynx)
  • 12W typ. Mobile PIII @ 500MHz (Lynx)
  • 10W typ. Mobile PIII @ 400MHz (Lynx)
Software Support Windows®NT®, Windows 2000, Windows®9x, Linux, VxWorks®, QNX®
Mass 220g (4TE)
Operating Temp. 0°C to +60°C (Ambient)
Extended Temp. -40 to +85°C (400MHz Mobile [Lynx] only)
Storage Temp. -40°C to +85°C
Humidity 5% to 95% (non-condensing)
Conformance PICMG 2.0 R3.0, CE

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