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6U CompactPCI Express CPU

with Rear Transition Module



Intel Core Duo 1.66Ghz CPU board, two PCIe x8, two PCIe x4 to backplane, up to 4GB SODIMM, one PMC, one XMC/PMC

Form Factor:  6U
Part Number: OSS-CPCIe-6U-CPU-CD-1.66-04-XX

                          Rear Transition Module:  OSS-CPCIe-6U-RTM-CD

Product Features

  • Intel Dual Core 1.66GHz low voltage processor with 533 MHZ FSB; 479 pin mFCBGA package directly soldered to the board
  • Intel E7520 North Bridge
  • Intel 6300ESB South Bridge
  • 1MB Firmware Hub or greater to support board features
  • Up to 4GB DRAM
  • One PMC site, one XMC/PMC site
  • VGA connector to front panel
  • Ethernet - 2 routed to rear I/O, 1 routed to Front Panel
  • Rear transition module (RTM) provides two GB Ethernet ports and two USB ports in addition to the one of each on the main board. Order using Part #OSS-RTM-6U-CD.
  • RTM's optional features depending on configuration:
    • Mouse/KB
    • CompactFlash
    • 2 Ethernet
    • Audio
    • IDE
    • 2 USB
    • I/O
    • SATA
    • 2 Serial
    • 2 PMC
    • LPT
     

6U CPCIe CPU Specifications

PROCESSOR: Intel Dual Core 1.66GHz Low Voltage processor with 533 MHZ FSB; 479 pin mFCBGA package directly soldered to the board.
FORM FACTOR: 6U CPCI Express form factor x 4HP wide
SPECIFICATION: PICMG EXP.0 system slot specification
CHIPSET:

Intel E7520 North Bridge

Intel 6300ESB South Bridge

EXPANSION: PCI Express connections: two PCIe x8 connections in two-link configuration, four PCIe x4 connections in four-link configuration
HOT SWAP SUPPORT: One Blue LED on the front panel with Hot Swap support.
LOCAL STORAGE OPTION:

One channel available through an on-board header for direct attach to an on-board HDD or to the drive mezzanine board. Option for additional 1 slot storage module.

BIOS (FLASH): General Software Stong Frame 6.0
CACHE MEMORY (L2): 1MB Firmware Hub or greater to support board features
MEMORY:

Two SO-RDIMM DDRII PC2-4200 533MHz SDRAM with ECC memory sockets capable of accepting the following memory configurations: 2 x 512MB modules for a total of 1GB memory.

2 x 1GB modules for a total of 2 GB memory

2 x 2GB modules for a total of 4GB total (such as Smart Modular part number SG572568DG8EWDG). SO-RDIMM memory sockets with metal retention clips

DUAL ETHERNET INTERFACES:

One RJ-45 connector on the front panel from the on-board Intel 82541EB 10/100/100 Ethernet.

On-board dual 10/100/1000 Ethernet using Intel's 82546GB PCI-X part with support for the following configurations: Two ports routed to the PICMG 2.16 compatible pins on the backplane. Optionally used on the RTM when P3 connector on the backplane has long tails for rear I/O.

REAR TRANSITION MODULE (OPTIONAL):  
UNIVERSAL SERIAL BUS (USB): One USB 2.0 port on front panel and three USB 2.0 ports available through the backplane rear I/O connector.
EIDE ULTRA ATA/100 INTERFACES (DUAL): Dual high-performance PCI EIDE interfaces are capable of supporting up to two IDE disk drives each in a master/slave configuration. The interfaces support Ultra ATA/100 with synchronous ATA mode transfers up to 100MB per second. The interfaces are routed through backplane connector J5. Dual EIDE connectors are available on the optional RTM25 rear transition module.

VIDEO INTERFACE:

One HD-DB15 VGA connector on the front panel from the on-board ATI Rage Mobility graphics controller.
SERIAL INTERFACE:

Dual Serial ATA in the following configurations: One channel available on the RTM with a standard SATA header

KEYBOARD AND PS/2 MOUSE INTERFACES: On-board header connector for one ATA-100 channel, 1 Serial ATA connection, PS/2 KYBD/MOUSE and 2 serial ports
POWER REQUIREMENTS: Typical Values
  CPU +5V* +3.3V*
  1.8GHz t.bdA t.bdA
  1.6GHz t.bdA t.bdA
  +12V @ tbdmA
  -12V @ <100mA
BATTERY: Battery backed-up Real Time clock
ENVIRONMENTAL: Operating Temperature 0° to 55° C.
  Storage Temperature: -20° to 70° C.
  Humidity: 5% to 90% non-condensing
  Cooling Solution: Passive Heat Sink

 



Download Datasheet
PDF File: 327KB

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