Products > NEBS Systems > 3U NEBS Server
 

 

 

3U NEBS Server

3U NEBS-compliant server is equipped with Intel® 5000 series Server Board, two Intel Xeon dualcore, processors, 500W AC or DC output power supply, and
a 3 ½" hot swappable drive shuttle. 


Part Number: OSS-MB-3U-SYS

Product Features

  • 3U ruggedized rackmount enclosure with front-to-rear airflow
  • Motherboard supporting two Intel 5140 dual core processors with 8GB DRAM
  • Dual redundant hot swappable 500W power supplies with two independent –48V power or AC feeds
  • 146GB SAS hard drive in hot swappable drive bay
  • Two Gigabit ethernet ports with rear access

Specifications

Dimensions 17" wide x 5.25" high x 20" deep
Cooling Fans Three 46.6CFM fans plus power supply fan providing front-to-rear airflow
Air Filter Three 45 ppi (pores per inch) air filter open cell polyurethane foam, UL 900 rating class 2,
UL 94 HF-1 NEB compliant
Chassis • USB connector on front panel
• Dual DC input on rear with internal Or-ing board
(DC version)
• 3 ½" hard drive shuttle
• Cable hold-down support on rear of enclosure
Weight 55 pounds (16.7 kg)
Overall MTBF 100,000 hours across all components
Construction Clear zinc plated (20 and 18 gauge) cold rolled steel
Power Supply

500W input power supply

AC Dual input on rear panel
-48VDC Dual input on rear panel
Outputs

+5 @ 30A, +12V @ 11A, -12V @ 1A, +3.3V @ 22A, -5V @ 1A

Integrated
On-Board
• Chipset
• Intel® Chipset 5000V
• Intel® Server Network Connections
• 2 x Intel Gigabit Ethernet connections
• Integrated Graphics
• ATI* ES1000 with 16MB SDRAM memory
Integrated Storage Support • Integrated ATA
• Integrated SATA
Intel® Server Board 5000 Series 4-port SAS Via Integrated Controller on Motherboard supporting RAID 0, 1, 10 with optional RAID 5
Input/Output PCI • 2 x PCI Express x8 (x16 Connectors)
• 1 x PCI Express x8 (x8 Connector)
• 1 x PCI Express x4 (x8 Connector)
• 2 x PCI-X 64-bit/133 MHz
Processor

• CPU Speed: 2.33 GHz
• Bus Speed: 1333 MHz
• Bus/Core Ratio: 7
• L2 Cache Size: 8 MB
• L2 Cache Speed: 2.33 GHz
• Package Type: LGA771
• Thermal Design Power: 80W
• Thermal Specification: 65°C

Memory Capacity 16GB ECC FBDIMMs (8 DIMMs) DDR 2 533/667mH
Operating Environment • Temperature Range: 0° to 50°C (32° to 122°F)
• Relative Humidity: 10 to 90% non-condensing
• Shock: 30g acceleration peak (11ms pulse)
• Vibration: 5-17 Hz 0.5” double amplitude
displacement; 7-2000Hz, 1.5g acceleration
Agency Meets or exceeds the following requirements:
• NEBS-compliant, FCC Class A
• Safety UL/CSA-60950-1, EN60950-1, IEC60950-1, CB Scheme with all country deviations, IEC825-1, 2, CFR21 part 1040, CNS1436, GB4943
• RFI/EMC EN55022 Class A, 47 CFR 15B Class A, ICES-003 Class A, VCCI Class A, AS/NZ 3548 Class A, CNS 13438 Class A, KSC 5858 Class A, GB9254 Class A,
EN61000-4-6, GB17625.1, EN6100-3-3
• Immunity EN55024, IEC 61000-4-2, IEC 61000-4-3, IEC 61000-4-4, IEC 61000 4-5, IEC 61000-4-6, IEC-61000-4-8, IEC 61000-4-11
• Regulatory markings CE, FCC, ICES-003, VCCI, UL/cUL

 


 

 

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