Products > PCIe-over-Cable > Downstream Devices > Expansion Link Board (ELB-SHB)
 
 

Expansion Link Board (ELB-SHB)

PCI Express x4 Expansion Link Board fits into the system slot of an SHB Express (PICMG 1.3) compliant backplane in a downstream expansion chassis.

Part Number: OSS-SHB-ELB-x4

Product Features

  • Two x4 PCI Express (10Gbps) connectors on slot cover
  • Upstream/downstream lane active LEDs on slot cover
  • Two x8 and one x4 PCI Express links through the PICMG 1.3 card edge connector
  • Power acceptable LEDs on board
  • Optional power connector for embedded applications without a backplane

The Expansion Link Board (ELB) is inserted into a downstream SHB Express (PICMG 1.3) compliant backplane. The ELB is a downstream cable link board and the primary fan-out switch to support multiple configurations of PCI/PCI-X or PCIe expansion slots. Twenty lanes of PCIe are auto-configurable on the card edge connector of the ELB.

When implemented with the MAXe Host Interface Board (HIB)or MAXe Host/Expansion Bridge Board (HEB), an expansion sub-system and a PCIe standard cable, a driverless, standards-based expansion system is achieved.

Specifications

Electrical/Mechanical Specifications
Form Factor PICMG 1.3 SHB Express system slot compliant
Dimensions (H x L) 4.375 x 6.600 in (111 x 161 mm)
Switch PLX PEX 8532 32 lane switch
Upstream Interface Two x4 PCI Express over cable
Downstream Interface 20 lanes of PCI Express are auto configurable on the card edge connectors as:
:: One x16 and one x4 PCIe links
:: Two x8 and one x4 PCIe links
:: Five x4 PCIe links
Front Panel Connector Two Molex 75586-0010
Front Panel Indicators ::Bank of 4 Upstream Lane Active Indicators (Green)
::Bank of 4 Downstream Link Active Indicators (Green)
Internal Indicators ::Power In-range Indicators for +12V, +3.3V & VTT (Red/Green)
::Power on indicator for +1V (Green)
::Bank of 5 board status indicators (Red)
Optional Features  
Switch Control 2-banks of DIP Switches for PEX 8532 configuration
Switch Debug Port Internal JTAG communications header
Heat Sink Passive or active heat sinks supported with fan header
Power Consumption 10W typical
  +12V @ .5A, 3.3V @ 1.25A, 5Vaux @ 2.5mA
Operating Environment+  
Temperature Range 0° to 70°C (32° to 122°F)
Relative Humidity 10 to 90% non-condensing
Shock 30g acceleration peak (11ms pulse)
Vibration 5-17 Hz 0.5” double amplitude displacement; 7-2000Hz, 1.5g acceleration
Agency Compliance+ UL 60950, FCC Class A, CE safety and emissions

Dimensional Drawing


Download Datasheet
PDF File: 229KB
Download Expansion Overview
PDF File: 54.8KB
Download User Manual
PDF File: 1.3MB

OSS-KIT-EXP-1000
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